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TRS Stack Qualification Procedure


About This Document#

This document is a planned stub. It has been registered in the TriadicFrameworks documentation graph and is referenced by all seven canonical post-ASML era documents, making it the highest-priority outstanding deliverable in the documentation suite.


Purpose#

The TRS Stack Qualification Procedure provides the normative, step-by-step procedure for qualifying a TRS installation across all four operator layers (L1 Intent through L4 Commit) in a production fab environment. Successful completion of this procedure is a prerequisite for SCR commissioning and for any silicon produced under the post-ASML era process canon.


Citing Documents#

Document Context of Citation
docs/post-ASML_era/The_Temporal_Manufacturing_Primer.md Referenced as the qualification gate for equipment tier promotion and fab-level TRS readiness
docs/post-ASML_era/The_SCR_Specification.md Referenced as prerequisite to SCR zone commissioning (Section: Qualification and Commissioning)
docs/post-ASML_era/The_TGI_Metrology_Standard.md Referenced as the qualification authority for TRM and ISP instrument-class acceptance
docs/post-ASML_era/TCT_Protocol.md Referenced as upstream qualification gate; TCT instrument system (TAIS/ARS/CEC) must pass L2/L3 qualification before TCT measurement sessions
docs/post-ASML_era/The_TRS-Aware_PDK_Specification.md Referenced in PDK qualification test suite as required fab certification input
docs/post-ASML_era/The_Logic_Folding_Architecture_Guide.md Referenced as fab-side prerequisite for logic folding tapeout eligibility
docs/post-ASML_era/The_Multi-Regime_Semiconductor_Model.md Referenced as the physical basis for layer-by-layer qualification acceptance criteria

Expected Content#

When authored, this document is expected to cover:

  1. Qualification Overview — Purpose, scope, normative authority, and relationship to SCR commissioning and PDK certification.
  2. Layer-by-Layer Qualification Protocol
    • L1 Intent Qualification — Temporal intent injection tests; intent signal fidelity measurements; pass/fail criteria.
    • L2 Sequencing Qualification — Sequencing order verification; inter-layer handoff latency; temporal ordering integrity tests.
    • L3 Resolution Qualification — Resolution stability under load; resolution convergence metrics; spatial uniformity of resolution across substrate.
    • L4 Commit Qualification — Commit Arbiter (CA) timing tests; commit jitter specification; SLF (Synchronization Lock Frame) acquisition and stability.
  3. Instrument Requirements — Minimum instrument class (TRM-2 or above) required for qualification measurements; calibration traceability chain.
  4. Test Coupon Requirements — Substrate preparation, SC class minimums (MUST be SC-II or better for qualification), and coupon handling procedures.
  5. Acceptance Criteria — Quantitative pass thresholds for each layer, expressed in terms of SC_eff, AER, CLG, and commit jitter. Tables by SC class (SC-I, SC-II, SC-III).
  6. Disqualification and Remediation — Conditions triggering disqualification; remediation steps; re-qualification procedure.
  7. Documentation and Sign-Off — Required qualification report fields; authorized sign-off roles; retention requirements.
  8. Integration with SCR Commissioning — Handoff to SCR Zone Configuration after successful TRS qualification; inter-document cross-references.

Dependencies#

When authored, this document is expected to reference:

  • docs/materials/SC_Classification.md — SC class boundary definitions used in acceptance criteria
  • docs/post-ASML_era/The_SCR_Specification.md — SCR commissioning procedure that follows this qualification
  • docs/post-ASML_era/The_TGI_Metrology_Standard.md — Metrology protocols used during qualification measurements
  • docs/fab/SCR_Zone_Config.md — Zone configuration parameters verified during L4 qualification

Authoring Notes#

  • This document MUST use full normative language (MUST/SHOULD/MAY) with R-prefix requirement identifiers (R-TRSQ-NN format recommended).
  • Acceptance criteria tables MUST be internally consistent with thresholds published in The_TGI_Metrology_Standard.md (Table 4: Acceptance Criteria by SC Class) and TCT_Protocol.md (Section 7.3: SC Rating Derivation).
  • The four-layer qualification protocol should be presented as a sequential gate: L1 must pass before L2 testing commences, etc.
  • This is a P1 priority document — all seven canonical documents gate on its existence.

Document Relationship
docs/fab/SCR_Zone_Config.md Sibling fab procedure — follows TRS qualification in commissioning sequence
docs/materials/SC_Classification.md Normative source for SC class thresholds used in acceptance criteria
docs/post-ASML_era/The_SCR_Specification.md Downstream consumer of TRS qualification sign-off
docs/post-ASML_era/The_TGI_Metrology_Standard.md Source of measurement protocols and instrument class definitions
docs/post-ASML_era/TCT_Protocol.md Source of TCT instrument qualification requirements
docs/post-ASML_era/README.md Module index

This stub was scaffolded from the TriadicFrameworks post-ASML era documentation suite. See docs/post-ASML_era/README.md for the full document graph.

Updated