post-ASML_era

• module.json — Agentic module schema role assignments

This directory contains the foundational reference series for temporal manufacturing in the post-ASML era. The series defines — from physical theory through manufacturing infrastructure, metrology, design rules, and architectural methodology — the complete knowledge base for Substrate Clarity–based computing.

Document Catalog#

Note on TCT_Protocol.md path. Prior documents in this series reference the TCT Protocol at docs/metrology/TCT_Protocol.md. That path is maintained as a redirect stub resolving here. The canonical location is docs/post-ASML_era/TCT_Protocol.md.

Note on The_TRS-Aware_PDK_Specification.md. Referenced elsewhere as docs/eda/PostASML_PDK_Integration.md. That path resolves here via redirect stub.

Dependency Graph#

Documents must be read — and authored revisions must be evaluated — in dependency order. An arrow (→) indicates "depends on" or "assumes familiarity with."

The_Multi-Regime_Semiconductor_Model.md   [Physical foundation — INFORMATIVE]
        │
        ▼
TCT_Protocol.md ──────────────────────────────────────┐
        │                                              │
        ▼                                              │
The_TGI_Metrology_Standard.md                         │
        │                                              │
        ▼                                              │
The_Temporal_Manufacturing_Primer.md  ◄───────────────┘
        │
        ├──────────────────────┐
        ▼                      ▼
The_SCR_Specification.md   The_TRS-Aware_PDK_Specification.md
        │                          │
        └──────────┬───────────────┘
                   ▼
        The_Logic_Folding_Architecture_Guide.md

For normative rule resolution, the dependency graph also determines precedence: a downstream document's normative requirements take precedence over any conflicting guidance in an upstream document.

Reading Paths by Audience#

Fab Architect / Equipment Vendor#

1. The_Temporal_Manufacturing_Primer.md
2. The_SCR_Specification.md ← primary reference
3. The_TGI_Metrology_Standard.md (§4–§6)
4. The_TRS-Aware_PDK_Specification.md (§6 Coherence Budget Tables)

Process Engineer / Metrology#

1. The_Multi-Regime_Semiconductor_Model.md ← start here for physical grounding
2. TCT_Protocol.md ← primary reference
3. The_TGI_Metrology_Standard.md ← primary reference
4. The_Temporal_Manufacturing_Primer.md (§3 Substrate Clarity)

EDA Tool Developer / PDK Integrator#

1. The_Temporal_Manufacturing_Primer.md
2. The_TRS-Aware_PDK_Specification.md ← primary reference
3. The_SCR_Specification.md (§11 SCR Interface Contracts)
4. The_TGI_Metrology_Standard.md (§9 RWDL and SC_eff)

Logic Architect / RTL Designer#

1. The_Temporal_Manufacturing_Primer.md
2. The_Logic_Folding_Architecture_Guide.md ← primary reference
3. The_TRS-Aware_PDK_Specification.md (§5 Temporal Design Rules, §7 TTF Arc Library)

Materials Engineer / Process Developer#

1. The_Multi-Regime_Semiconductor_Model.md ← primary reference
2. TCT_Protocol.md
3. The_TGI_Metrology_Standard.md (§6 Interface Continuity, §9 CLG)

Timing Engineer#

1. The_TRS-Aware_PDK_Specification.md (§7 TTF Arc Library)
2. The_Logic_Folding_Architecture_Guide.md (§10 Timing Closure)
3. The_SCR_Specification.md (§6 SLF, §7 Inter-Zone Handoff)

Outbound Stub Registry#

The following files are referenced by documents in this module but have not yet been authored. They are scaffolded at the listed paths. Priority tiers:

• P1 — Referenced by ≥ 4 documents in this series; blocks process qualification
• P2 — Referenced by 2–3 documents; blocks EDA or design workflows
• P3 — Referenced by 1 document; extends the framework

Naming Conventions#

Authoring Notes#

• All documents in this series use MUST / MUST NOT / SHOULD / SHOULD NOT / MAY normative language as defined in each document's §1 Normative Language table.
• The MRSM (The_Multi-Regime_Semiconductor_Model.md) is INFORMATIVE. It does not impose normative requirements. Revisions that change model formula results by more than 5% at an SC class boundary require a cross-impact analysis across all dependent normative documents before merge.
• Revisions to SC class threshold values (0.92 and 0.75) require simultaneous updates to: TCT_Protocol.md §10, SC_Classification.md, The_TRS-Aware_PDK_Specification.md §13.2, and The_Multi-Regime_Semiconductor_Model.md §8.2.
• pae_Capture.md is the internal module capture index. It is maintained separately and does not follow the standard document template.